Method for planarizing bumped die

Details Method for planarizing bumped die Method for planarizing bumped die

2005-03-22

2005-03-22

Phung, Anh (Department: 2824)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S015000, C438S106000, C438S118000

Reexamination Certificate

active

06869832

ABSTRACT:
According to one embodiment of the invention, a method for planarizing bumped die includes providing a die having a plurality of stud bumps, encapsulating the stud bumps with an epoxy-based material, and disposing a release layer outwardly from the epoxy-based material. A surface of the release layer that engages the epoxy-based material is substantially planar. The method further includes curing the epoxy-based material and removing the release layer after the curing step, thereby creating a substantially planar surface of the epoxy-based material.

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PCT Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority or the Declaration, mailed Jul. 22, 2004, regarding PCT/US 2004/001905 filed Jan. 23, 2004 (7 pages).

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