Method for planarizing a semiconductor device surface with polym

Etching a substrate: processes – Nongaseous phase etching of substrate – Using film of etchant between a stationary surface and a...

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216 89, H01L 21302

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active

059001640

ABSTRACT:
The present invention relates to an article of manufacture or polishing pad for altering a surface of a workpiece, such as polishing or planarizing a semiconductor device. The article includes a polymeric matrix impregnated with a plurality of polymeric microelements, each polymeric microelement having a void space therein. The article has a work surface and a subsurface proximate to the work surface. When the article is in contact with a working environment, polymeric microelements at the work surface of the article are less rigid than polymeric elements embedded in the subsurface. As the work surface of the article is abraded during use, the work surface of the pad may be continuously regenerated. In alternative preferred embodiments, the work surface may further include a minitexture and/or a macrotexture. Preferably, the minitexture is formed by fractal patterning at least a portion of the work surface. The present invention also includes methods for decreasing the effective rigidity of polymeric microelements at the work surface of the article, regenerating the work surface of the article and planarizing a surface of a semiconductor device utilizing the article.

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