Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface...
Reexamination Certificate
2006-09-05
2006-09-05
King, Roy (Department: 1742)
Electrolysis: processes, compositions used therein, and methods
Electrolytic erosion of a workpiece for shape or surface...
C205S662000, C205S663000, C205S674000, C205S686000, C204S22400M, C204S22400M, C451S113000, C451S162000
Reexamination Certificate
active
07101471
ABSTRACT:
An electroetching process of the present invention uses a multiphase environment for planarizing a wafer with conductive surface having a non-uniform topography. The multiphase environment includes a high resistance phase and an etching solution phase. The conductive surface to be planarized is placed in the high resistance phase and adjacent a phase interface between the high resistance phase and the etching solution phase. A wiper is used to mechanically move the thin high resistance phase covering the conductive surface so that the raised regions of the non-planar conductive surface is briefly exposed to etching solution phase. The mechanical action of the wiper does not disturb the high resistivity phase filling the rescessed regions of the surface. As the raised surface locations are exposed, the etching solution phase contacts and electroetch the exposed regions of the raised regions until the surface planarized.
REFERENCES:
patent: 6315883 (2001-11-01), Mayer et al.
patent: 6811680 (2004-11-01), Chen et al.
patent: 2005/0150777 (2005-07-01), Basol
ASM Nutool, Inc.
King Roy
Knobbe Martens Olson & Bear LLP
Zheng Lois
LandOfFree
Method for planar material removal technique using... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for planar material removal technique using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for planar material removal technique using... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3553009