Method for placing electrically conductive paths on a substrate

Details Method for placing electrically conductive paths on a substrate Method for placing electrically conductive paths on a substrate

1985-04-03

1986-09-30

Lechert, Jr., Stephen J.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29846, 29851, 361401, 361402, 427 71, 427 96, 427123, 428901, 419 8, 419 10, 419 23, 419 24, 419 48, 419 66, H05K 100

Patent

active

046148370

ABSTRACT:
A process for placing conductive paths on to the surface of a heat softenable substrate by applying a layer of metal powder to the substrate, compacting the powder in a pre-determined pattern by applying a heated die under pressure, and embedding the compacted powder by the continued application of the die at a pressure less than the compacting pressure.

REFERENCES:
patent: 3800020 (1974-03-01), Parfet
patent: 4394709 (1983-07-01), Brower et al.
patent: 4394710 (1983-07-01), Brower et al.
patent: 4510174 (1985-04-01), Holzapfel et al.

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