Method for photoselective seeding and metallization of three-dim

Details Method for photoselective seeding and metallization of three-dim Method for photoselective seeding and metallization of three-dim

1996-10-25

2000-01-25

Jones, Deborah

Stock material or miscellaneous articles

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Discontinuous or differential coating, impregnation or bond

430311, 430315, 430417, 156656, 428901, 439 55, B32B 900

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active

06017613&

ABSTRACT:
A method is provided for selectively metallizing one or more three-dimensional materials in an electronic circuit package comprising the steps of forming a layer of seeding solution on a surface of the three-dimensional material of interest, exposing this layer to light of appropriate wavelength, resulting in the formation of metal seed on regions of the three-dimensional material corresponding to the regions of the layer of seeding solution exposed to light; removing the unexposed regions of the layer of seeding solution by subjecting the exposed and unexposed regions of the layer of seeding solution to an alkaline solution. Thereafter, additional metal is deposited, e.g., plated, onto the metal seed using conventional techniques. Significantly, this method does not involve the use of a photoresist, or of a corresponding chemical developer or photoresist stripper. Of additional significance, this method is ideal for plating three-dimensional materials such as cone-shaped connectors used in electronic circuit packages.

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patent: 4757035 (1988-07-01), Baney et al.
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patent: 5529829 (1996-06-01), Koskenmaki et al.
IBM Technical Disclosure Bulletin, vol. 33 No. 6B Nov. 1990. by T.H. Baum.
Photoselective Catalysis of Electroless Copper Solution for the Formation of Adherent Copper Films into Polyimide by T.H. Baum, May, 1991.

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