Method for photoresist stripping using reverse flow

Details Method for photoresist stripping using reverse flow Method for photoresist stripping using reverse flow

1990-09-11

1991-12-10

Morris, Theodore

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 19, 134 31, 134 37, 156640, 156662, 219390, 219405, 219411, B08B 500

Patent

active

050714856

ABSTRACT:
A method and apparatus for stripping a photoresist layer from a semiconductor wafer, wherein oxidizing gas is fed from the edge of the wafer to the center. The oxidizing gas may be directed so that it is incident on the heated wafer support platform before it is incident on the wafer.

REFERENCES:
patent: 4341592 (1982-07-01), Shortes et al.
patent: 4544446 (1985-10-01), Cady
patent: 4885047 (1989-12-01), Ury et al.

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