Method for photopatterning metallization via UV-laser ablation o

Details Method for photopatterning metallization via UV-laser ablation o Method for photopatterning metallization via UV-laser ablation o

1988-08-23

1989-11-21

Silverberg, Sam

Coating processes

Electrical product produced

Welding electrode

427 541, 427 98, 427306, 156632, B05D 306, B05D 512, B05D 304, B44C 122

Patent

active

048822000

ABSTRACT:
A laser, such as an excimer laser, is employed to ablate electroless plating activator material from polymer and other substrates. The treated substrates are then immersed in electroless plating baths for plating of conductive material over remaining activator material. The method is particularly effective for depositing conductive patterns on non-flat substrates and on substrates needing plated-through connections. High resolution patterns are created on any compatible polymer substrate with any compatible electroless plating activator material.

REFERENCES:
patent: 3791340 (1974-02-01), Ferrara
patent: 3950570 (1976-04-01), Kenney
patent: 3954570 (1976-05-01), Shirk et al.
patent: 4078096 (1978-03-01), Redmond et al.
patent: 4112139 (1978-09-01), Shirk et al.
patent: 4414059 (1983-11-01), Blum et al.
patent: 4417948 (1983-11-01), Mayne-Banton et al.
patent: 4440801 (1984-04-01), Aviram et al.
patent: 4508749 (1985-04-01), Brannon et al.
patent: 4617085 (1986-10-01), Cole et al.
patent: 4684437 (1987-08-01), Donelon et al.
patent: 4686114 (1987-08-01), Halliwell et al.
patent: 4780177 (1988-10-01), Wojnarowski et al.
"Webster's 3.sup.rd New International Dictionary", unabridged, Ed. Grove G & C. Merrian Co., Publishers, Springfield, Mass., USA 1961, p. 4.

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