Method for photo-fabrication inspection using a sublayer of cupr

Details Method for photo-fabrication inspection using a sublayer of cupr Method for photo-fabrication inspection using a sublayer of cupr

1976-01-05

1976-08-31

Kimlin, Edward C.

Gas separation: apparatus

Electric field separation apparatus

With means to add charged solid or liquid particles to...

96 27E, 96 36, 96 362, 156 3, 156 8, G03C 500, G03C 504

Patent

active

039778738

ABSTRACT:
A method for treating a surface of copper or copper alloy upon which a photo-etched pattern is to be provided comprising applying a relatively thin coating of cupric chloride formed from a relatively weak solution, drying said coating for moisture removal and then applying a photographic emulsion thereover. The thickness of the cupric chloride coating is approximately 1/10th or less that of the photographic emulsion and upon reaction to light emission effects a color change which is visible through the photographic emulsion thereby permitting rapid inspection of the ultimate pattern to be formed prior to performance of the customary developing, etching, and finishing techniques.

REFERENCES:
patent: 3441628 (1976-03-01), Caule
"An Introduction to Photofabrication Using Kodak Photosensitive Resists," 1967, p. 25.

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