Method for perforating heat sensitive stencil sheet

Printing – Stenciling – Stencils

Patent

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10112821, B41C 114

Patent

active

059243619

ABSTRACT:
A method of perforating a heat-sensitive stencil sheet is provided which can give prints of high quality having sharp images high in density and free from seep through. This method comprises ejecting a photothermal conversion material contained in a liquid together with the liquid from a liquid ejector to transfer it in the form of dots onto a heat-sensitive stencil sheet, and then exposing the heat-sensitive stencil sheet to a visible or infrared ray to perforate the heat-sensitive stencil sheet specifically at portions to which the photothermal conversion material has been transferred, the dots satisfying the relation 3R.gtoreq.D>R in which R is diameter of the dot of the photothermal conversion material transferred and recorded onto the heat-sensitive stencil sheet and D is a pitch between adjacent dots. It is preferred that the heat-sensitive stencil sheet has a liquid absorbing layer on at least one side, and the liquid containing the photothermal conversion material is ejected onto the liquid absorbing layer. The liquid absorbing layer preferably has a contact angle with the liquid of 20-150 degrees. The liquid absorbing layer can be formed by appropriately mixing a hydrophilic resin and a water-repellent compound.

REFERENCES:
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patent: 4139759 (1979-02-01), Hayama et al.
patent: 4996137 (1991-02-01), Inoue et al.
patent: 5146236 (1992-09-01), Hirata et al.
patent: 5415090 (1995-05-01), Natori et al.
patent: 5662039 (1997-09-01), Watanabe

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