Coating processes – Electrical product produced – Welding electrode
Patent
1990-10-19
1992-01-28
Beck, Shrive
Coating processes
Electrical product produced
Welding electrode
427 541, 427 96, 427 98, 156628, 156654, 156656, B05D 306, B05D 512, H01L 21312
Patent
active
050842994
ABSTRACT:
A method for patterning electroless plated metal on a polymer substrate. In a first embodiment a substrate is first coated with a polymer suitable for complexing a seed metal which can initiate electroless plating. The polymer is then mixed with a seed metal such as palladium, selectively irradiated to form the desired conductor pattern, and then etched so that the desired pattern remains. The substrate is subsequently placed in an electroless plating bath to form a metal pattern. In a second embodiment, before applying the seed metal a substrate immersed in a polymer solution suitable for complexing a seed metal can be selectively irradiated to selectively deposit polymer on the substrate, followed by applying a seed metal to form a polymer-seed metal mixture and an electroless plating bath. In addition, an alkaline chemical may be added to an acidic polymer to prevent the polymer from etching metal on the substrate.
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Hirsch Tom J.
Lin Charles W. C.
Yee Ian Y. K.
Beck Shrive
Microelectronics and Computer Technology Corporation
Padgett Marianne L.
Sigmond David M.
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