Method for patterning devices

Details Method for patterning devices Method for patterning devices

1999-11-23

2001-09-25

Pham, Long (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C438S023000, C438S034000, C438S035000, C438S099000, C257S040000, C257S079000, C257S088000

Reexamination Certificate

active

06294398

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to patterning methods for thin films, and more particularly to patterning methods using a die.
BACKGROUND OF THE INVENTION
Organic light emitting devices (OLEDs), which make use of thin films that emit light when excited by electric current, are becoming an increasingly popular technology for applications such as flat panel displays. Popular OLED configurations include double heterostructure, single heterostructure, and single layer, as described in PCT Application WO 96/19792, which is incorporated herein by reference.
To form an array of OLEDs, the constituent materials must be patterned. Such patterning may be achieved by photoresist methods, as disclosed by U.S. Pat. No. 5,641,611 to Shieh, and in U.S. patent application Ser. No. 08/977,205 now U.S. Pat. No. 6,013,538. Shadow masks may also be used to pattern, as disclosed by co-pending U.S. patent application Ser. No. 09/182,636. Shadow masks must be thick enough to provide mechanical strength and thus, the obtainable resolution of the pattern is limited. Other methods of patterning have been used, such as excimer laser ablation and conformal masks.
While these known patterning methods are acceptable in certain circumstances, a more accurate, faster and less expensive method of patterning is desirable.
SUMMARY OF THE INVENTION
A method of fabricating a device is provided. The method includes depositing a first layer of organic materials over a substrate; depositing a second layer, which is an electrode, over the first layer; pressing a patterned die having a raised portion onto the second layer; and removing the patterned die. Additionally, a third layer may be deposited between the substrate and the second layer. The third layer is preferably an electrode.


REFERENCES:
patent: 5641611 (1997-06-01), Shieh et al.
patent: 5707745 (1998-01-01), Forrest et al.
patent: 5925259 (1999-07-01), Biebuyck et al.
patent: 6013538 (2000-01-01), Burrows et al.
patent: 6027630 (2000-02-01), Cohen
patent: WO 96/19792 (1996-06-01), None
Co-pending U.S. application Serial No. 09/182,636, filed Oct. 30, 1998, entitled “Method for Patterning Devices”.

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