Etching a substrate: processes – Forming or treating article containing magnetically...
Reexamination Certificate
2006-04-04
2006-04-04
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Forming or treating article containing magnetically...
C216S013000, C216S017000, C216S018000, C216S088000, C216S089000, C029S603010
Reexamination Certificate
active
07022248
ABSTRACT:
A method for patterning a self-aligned coil using a damascene process is disclosed. Coil pockets are formed in a first insulation layer disposed over a first pole layer. A barrier/seed layer is deposited along walls of the coil pockets in the insulation layer. Copper is formed in the coil pockets and over the insulation layer. The copper is planarized down to the insulation layer. The self-aligned coil process packs more copper into the same coil pocket and relaxes the coil alignment tolerance. Protrusions are prevented because of the more efficient and uniform spacing of the coil to reduce heat buildup in the head during a write.
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Bedell Daniel Wayne
Le Quang
Lee Edward Hin Pong
Nguyen Son Van
Nikitin Vladimir
Ahmed Shamim
Chambliss Bahner & Stophel P.C.
Hitachi Global Storage Technologies - Netherlands B.V.
Lynch David W.
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