Etching a substrate: processes – Nongaseous phase etching of substrate – Substrate is multilayered
Patent
1995-04-05
1998-11-24
Dang, Thi
Etching a substrate: processes
Nongaseous phase etching of substrate
Substrate is multilayered
216 99, 505190, 505410, 505728, H01L 2100
Patent
active
058402047
ABSTRACT:
A method for patterning an oxide superconductor thin film, comprising a step of forming a SiO.sub.2 layer on the oxide superconductor thin film, patterning the SiO.sub.2 layer so as to form the same pattern as that of the oxide superconductor thin film which will be patterned, etching the oxide superconductor thin film by using the patterned SiO.sub.2 layer as a mask, and removing the SiO.sub.2 layer by using a weak HF solution, a buffer solution including HF or a mixture including HF.
REFERENCES:
patent: 4933318 (1990-06-01), Heijman
patent: 5219830 (1993-06-01), Jeong et al.
Eidelloth, W., et al., "Wet Etch Process for Patterning Insulators Suitable for Epitaxial High T.sub.c Superconducting Thin Film Multilevel Electronic Circuits", Applied Physics Letters, vol. 59, No. 10, pp. 1257-1259, Sep. 1991.
Iiyama Michitomo
Inada Hiroshi
Tanaka So
Dang Thi
Sumitomo Electric Industries Ltd.
LandOfFree
Method for patterning a layer on oxide superconductor thin film does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for patterning a layer on oxide superconductor thin film , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for patterning a layer on oxide superconductor thin film will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1698592