Method for patterned metallization of a substrate surface

Details Method for patterned metallization of a substrate surface Method for patterned metallization of a substrate surface

1995-04-21

1996-11-19

Gorgos, Kathryn

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

427 98, 427304, 427306, 4274431, 216 65, B05D 512

Patent

active

055760732

ABSTRACT:
A method for patterned metallization of the surface of substrates (1), particularly circuit boards, using electromagnetic radiation (5) in which an electrically nonconducting prime coat (2) is applied full-surface to the substrate (circuit board 1); an electrically nonconducting cover coat which is easily ablated by electromagnetic irradiation (5) in the ultraviolet range is applied full-surface to the prime coating (2), the cover coat (4) being applied in a thickness that is at least equal to the thickness of the metal layer that is to be applied; the cover coat is removed from partial areas by the action of electromagnetic irradiation (5) in the ultraviolet range to form patterns (6) with sharp and steep flanks (7) and expose the prime coat (2); and in the area of the exposed patterns (6) on the prime coat (2), a metal layer is applied, guided by the flanks (7), in a reducing bath. The method facilitates patterned metallization with a very high resolution on the surface of substrates, without the need for an etching procedure.

REFERENCES:
patent: 3791340 (1974-02-01), Ferrara
patent: 4508749 (1985-04-01), Brannon et al.
patent: 4842677 (1989-06-01), Wojnarowski et al.
patent: 4865873 (1989-12-01), Cole, Jr. et al.
Giesecke et al., "Herstellung flexibler Schaltungen mit Bayprint-eine zukunftsweisende Technologie", Galvanotechnik, vol. 84, No. 2, pp. 570-575 (1993). No month available.

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