Method for passing and bonding a cable through and to an inner w

Details Method for passing and bonding a cable through and to an inner w Method for passing and bonding a cable through and to an inner w

1991-11-19

1993-09-28

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156235, 156293, 62 511, B32B 3100

Patent

active

052483657

ABSTRACT:
The present invention provides a method for passing a flat polyimide film cable as a communication cable (signal line) to a specimen through the inner wall made of FRP material and the outer wall of the cryostat for cooling a specimen such as, for example, a semiconductor operated in cryogenic liquid such as liquefied helium, particularly a method for passing the cable through the inner wall and sealing it thereto. A slit is provided in advance in the inner wall and an FRP layer is formed in advance on both surfaces of the polyimide film cable along distance sufficiently larger than the thickness of the inner wall, then the polyimide film cable provided with the FRP layer is passed through the slit so that part of the FRP layer is positioned inside the slit and the surface of the FRP layer and the internal surface of the slit are bonded and sealed with the adhesive.

REFERENCES:
patent: 4773228 (1988-09-01), Murai et al.
patent: 4856297 (1991-08-01), Yasue
patent: 4986077 (1991-01-01), Saho et al.

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