Method for palladium activating molybdenum metallized features o

Details Method for palladium activating molybdenum metallized features o Method for palladium activating molybdenum metallized features o

1983-11-30

1985-04-09

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29840, 29851, 156230, 156239, 427 96, 427125, 4271262, C04B 3500, C04B 3900

Patent

active

045100004

ABSTRACT:
A molybdenum or tungsten metallurgical pattern is formed on or in a dielectric green sheet. Palladium, nickel, platinum or rhodium is coated on a layer of polyvinyl butyral which is carried on a polyester film. The metal layer of this assembly is laminated to a dielectric green sheet which carries the molybdenum or tungsten metallurgy. The polyester film is stripped off. The resulting assembly is sintered to a fired structure, whereby the polyvinyl butyral is volatilized off and the palladium, nickel, platinum or rhodium is alloyed with the molybdenum or tungsten metallurgy to provide a densified metallurgy whose surface is free of glass.

REFERENCES:
patent: 3651567 (1972-03-01), Fenner et al.
patent: 3978248 (1976-08-01), Usami
patent: 3999004 (1976-12-01), Chirino et al.
patent: 4340618 (1982-07-01), Fury et al.

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