Package making – Methods – Filling preformed receptacle and closing
Patent
1994-05-09
1995-09-12
Culver, Horace M.
Package making
Methods
Filling preformed receptacle and closing
53472, 53475, B65B 510, B65B 2500
Patent
active
054488770
ABSTRACT:
A combination magazine and shipping tray for lead frames cut into discrete length strips. The magazine collects discrete length lead frame strips dispensed from an automated lead frame quality inspection machine. A cover, when placed over the magazine, provides a packaging tray for shipment of the collected lead frame strips to a semiconductor integrated circuit packaging facility. At the packaging facility, the cover is removed and the magazine is a loading magazine for loading discrete length lead frame strips into a machine used for packaging ICs.
REFERENCES:
patent: 1276326 (1918-08-01), Casper
patent: 1740424 (1929-12-01), Blaine
patent: 2106975 (1938-02-01), Francis
patent: 2119561 (1938-06-01), Smith
patent: 2607594 (1952-08-01), Rubinoff
patent: 2850855 (1958-09-01), Offutt
patent: 3360258 (1967-12-01), Nix
patent: 3369339 (1968-02-01), Speiser
patent: 3469684 (1969-09-01), Keady et al.
patent: 3541758 (1970-11-01), Welborn
patent: 3594977 (1971-07-01), Grasvoll
patent: 3691289 (1972-09-01), Rohloff
patent: 3826058 (1974-07-01), Preisig
patent: 3974626 (1976-08-01), Getsch
patent: 4043485 (1977-08-01), Tippetts
patent: 4457662 (1984-07-01), Ireland et al.
patent: 4483441 (1984-11-01), Akizawa et al.
patent: 4679381 (1987-07-01), Truninger
patent: 4683644 (1987-08-01), Tange et al.
patent: 4706438 (1987-11-01), Ohlbach
patent: 4798305 (1989-01-01), Laverty
patent: 4906162 (1990-03-01), Long et al.
patent: 4979352 (1990-12-01), Davis et al.
patent: 5012925 (1991-05-01), Gallagher, Sr.
patent: 5076204 (1991-12-01), Hisamune
patent: 5099634 (1992-03-01), Treloar
patent: 5125509 (1992-06-01), Takei et al.
T. A. Anzelone, G. T. Davis, L. P. Remsen and A. A. Stricker, IBM Technical Disclosure Bulletin, vol. 23, No. 7A, Dec. 1980, pp. 2655 & 2656.
Culver Horace M.
National Semiconductor Corporation
Nelson H. Donald
Pitruzzella Vincenzo D.
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