Method for packing electronic device by interconnecting...

Details Method for packing electronic device by interconnecting... Method for packing electronic device by interconnecting...

2005-08-16

2005-08-16

Nguyen, Tuyen T (Department: 2832)

Metal working

Method of mechanical manufacture

Electrical device making

Reexamination Certificate

active

06928725

ABSTRACT:
A packing structure of an electronic device by interconnecting a frame and frame leads with an insulating block is provided. The packing structure has the advantage of measuring the electrical characteristics of the semi-product before being subject to a plastic molding. The packing structure includes a frame having a package area where an electronic device is disposed, an insulating block disposed on one side of the package area and connected to the frame, and a plurality of frame leads aligned in parallel and connected to the insulating block and the electronic device.

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patent: 5345670 (1994-09-01), Pitzele et al.
patent: 5396032 (1995-03-01), Bonham et al.
patent: 5661900 (1997-09-01), McLellan et al.
patent: 5692296 (1997-12-01), Variot
patent: 5939775 (1999-08-01), Bucci et al.
patent: 6332269 (2001-12-01), Gamel et al.

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