Method for packing a measured quantity of thermosetting resin an

Details Method for packing a measured quantity of thermosetting resin an Method for packing a measured quantity of thermosetting resin an

1989-11-22

1992-03-24

Lorin, Hubert C.

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

Forming continuous work followed by cutting

264145, 264167, 26427215, 26427217, 2643282, 2643284, 2643285, B29C 3106, B29C 4502, B29C 4304

Patent

active

050986260

ABSTRACT:
Method for packing a measured quantity of thermosetting resin, intended for encapsulating a component such as an integrated circuit by introducing this quantity into a flexible plastics covering which can be sealed airtight, and packing for a measured quantity of thermosetting resin intended for encapsulating a component.

REFERENCES:
patent: 2166643 (1939-07-01), Salfisberg
patent: 2338607 (1944-01-01), Wacker
patent: 3493392 (1970-01-01), Kasmatsu et al.
patent: 4954301 (1990-09-01), Saeki et al.

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