Method for packaging thermoplastic compositions using a thermall

Details Method for packaging thermoplastic compositions using a thermall Method for packaging thermoplastic compositions using a thermall

1995-06-07

1998-02-10

Johnson, Linda

Package making

Methods

With contents treating

53453, 264255, 264338, B65B 4710, B65B 6308

Patent

active

057156549

ABSTRACT:
A process of continuously packaging a thermoplastic composition such as a pressure sensitive hot melt adhesive. The method includes the steps of (a) forming a thermoplastic film to a rigid mold wherein said film becomes molten at or below the usage temperature of a hot melt adhesive composition, and the mold is in contact with ambient air; (b) dispensing hot melt adhesive into the lined mold; (c) disposing a thermoplastic film on the surface of the mold to form a packaged hot melt adhesive; (d) allowing the hot melt adhesive to reach a state in the presence of ambient air such that the packaged hot melt adhesive is removable from the mold.

REFERENCES:
patent: 2762504 (1956-09-01), Sparks et al.
patent: 4054632 (1977-10-01), Franke
patent: 4306657 (1981-12-01), Levy
patent: 4748796 (1988-06-01), Viel
patent: 4755245 (1988-07-01), Viel
patent: 5257491 (1993-11-01), Rouyer et al.
patent: 5307608 (1994-05-01), Muir et al.
patent: 5401455 (1995-03-01), Hatfield

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