Method for packaging small size memory cards

Details Method for packaging small size memory cards Method for packaging small size memory cards

2006-08-15

2006-08-15

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S412000, C029S417000, C029S830000, C029S832000, C029S842000, C029S855000, C361S737000

Reexamination Certificate

active

07089661

ABSTRACT:
A method is disclosed for packaging a small size memory card, including xD Picture card, Memory Stick™, Secure Digital™ (SD) card, SmartMedia™ (SM) card, Multimedia card (MMC), CompactFlash™ (CF) card and PC card, by moulding over to encapsulate a populated printed circuit board (PCB) (10) to form the standard external dimensions and features of the memory card.The method comprises holding the populated PCB (10) in place in a cavity (44) of at least one mould piece; and moulding over both sides of the populated printed circuit board (10) to encapsulate said board. Various embodiments are disclosed, including means for holding the populated PCB (10) in the moulding cavity (44) for the encapsulation process, which includes transfer moulding and injection moulding processes, one or more moulding steps, and moulding over one part of one side of said board before the other side, and/or simultaneously moulding over both sides of said board.

REFERENCES:
patent: 5689137 (1997-11-01), Weber
patent: 5895222 (1999-04-01), Moden et al.
patent: 6000924 (1999-12-01), Wang et al.
patent: 6128195 (2000-10-01), Weber et al.
patent: 6484394 (2002-11-01), Heo et al.

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