Method for packaging semiconductor devices in a resin

Details Method for packaging semiconductor devices in a resin Method for packaging semiconductor devices in a resin

1989-09-08

1992-01-21

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

Direct application of fluid pressure differential to...

Producing multilayer work or article

264571, 264102, 26427214, 26427217, B29C 4502, B29C 4514

Patent

active

050826158

ABSTRACT:
A method for packaging semiconductor devices in resin uses a mold having a pot and cavities, a vacuum pump for drawing off the air contained in the pot and the gases emitted from a resin tablet placed in the pot, and a pressing piston for pressing the resin tablet to feed the resin to the cavities. The pot has a volume which is greater than the maximum volume to which the heated resin tablet expands in a vacuum. The method includes the steps of placing the resin tablet in the pot, heating the resin under an applied vacuum until it expands to a sufficient extent to draw away gas trapped in the heated resin tablet, pressing the heated resin to the cavities to surround semiconductor devices placed therein, and curing the resin.

REFERENCES:
patent: 4123215 (1978-10-01), Madenokoji
patent: 4314955 (1982-02-01), Boden et al.
patent: 4412804 (1983-11-01), Huther
patent: 4482515 (1984-11-01), Buhler
patent: 4714423 (1987-12-01), Hattori et al.

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