Method for packaging semiconductor device and package...

Details Method for packaging semiconductor device and package... Method for packaging semiconductor device and package...

2006-11-30

2010-12-21

Landau, Matthew C (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S432000, C257S433000, C257S434000, C257S435000, C438S116000

Reexamination Certificate

active

07855424

ABSTRACT:
A method for packaging a semiconductor device includes following steps. First, a first substrate including at least one first pattern is provided. At least one semiconductor device is disposed on the surface of the first substrate. Next, a spacer with at least one aperture and at least one through hole is provided. Then, the first pattern is aimed at the through hole to connect the first substrate and the spacer, so that the semiconductor device is positioned correspondingly to the aperture. Afterwards, a second substrate including at least one second pattern is provided. Thereon, the second pattern is aimed at the through hole, so that the second substrate is connected to the spacer correspondingly.

REFERENCES:
patent: 6441481 (2002-08-01), Karpman
patent: 6759668 (2004-07-01), Matsuo et al.
patent: 6929974 (2005-08-01), Ding et al.
patent: 7692720 (2010-04-01), Nishida et al.
patent: 2005/0236708 (2005-10-01), Farnworth et al.
patent: 2006/0043512 (2006-03-01), Oliver et al.

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