Package making – Methods – Group forming of contents into a unit
Patent
1995-12-26
1997-07-08
Sipos, John
Package making
Methods
Group forming of contents into a unit
206204, 206719, 2064591, 53471, 53485, B65B 3550
Patent
active
056448996
ABSTRACT:
Airtight ESD-protected containers (42) are used to transport semiconductor components (12). A reclosable lid (44) snaps onto the rectangular container (42) to provide the airtight environment. The shape of the container allows stacking of multiple containers inside a larger outer box for shipping to the customer site. Both the lid and the container are reusable which provides cost savings spread over their useful life. Transporting semiconductor components in this manner does not use small cardboard boxes or dry-pack bags.
REFERENCES:
patent: 2446361 (1948-07-01), Clibbon
patent: 2459400 (1949-03-01), Williams
patent: 3958746 (1976-05-01), Wilbur
patent: 4091921 (1978-05-01), Lewis
patent: 4098577 (1978-07-01), Halpern
patent: 4206844 (1980-06-01), Thukamoto et al.
patent: 4480747 (1984-11-01), Kazor et al.
patent: 4528222 (1985-07-01), Rzepecki et al.
patent: 4529087 (1985-07-01), Neal et al.
patent: 4579223 (1986-04-01), Otsuka et al.
patent: 4579246 (1986-04-01), Swearingen et al.
patent: 4592192 (1986-06-01), Jacob et al.
patent: 4597244 (1986-07-01), Pharo
patent: 4677809 (1987-07-01), Long et al.
patent: 4681218 (1987-07-01), Williams
patent: 4752002 (1988-06-01), Takahashi et al.
patent: 4793123 (1988-12-01), Pharo
patent: 4799350 (1989-01-01), Rias
patent: 4813791 (1989-03-01), Cullen et al.
patent: 4825624 (1989-05-01), Calcerano
patent: 4861632 (1989-08-01), Caggiano
patent: 4867038 (1989-09-01), Thorstenson
patent: 4872558 (1989-10-01), Pharo
patent: 4874093 (1989-10-01), Pharo
patent: 4918904 (1990-04-01), Pharo
patent: 4923059 (1990-05-01), Evers et al.
patent: 4949530 (1990-08-01), Pharo
patent: 4966280 (1990-10-01), Bradford
patent: 4969750 (1990-11-01), Russo et al.
patent: 4971196 (1990-11-01), Kitamura et al.
patent: 5009308 (1991-04-01), Cullen et al.
patent: 5043195 (1991-08-01), Skrivseth
patent: 5224373 (1993-07-01), Williams et al.
patent: 5272856 (1993-12-01), Pharo
patent: 5299408 (1994-04-01), Dupont
patent: 5318181 (1994-06-01), Stover et al.
patent: 5353574 (1994-10-01), Copham et al.
"AmeriStar Packaging competition," Duncan, et al., Motorola Manufacturing Systems; Oct. 19, '94.
Motorola Inc.
Paradiso John
Sipos John
LandOfFree
Method for packaging semiconductor components for shipment does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for packaging semiconductor components for shipment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for packaging semiconductor components for shipment will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2403650