Metal working – Piezoelectric device making
Patent
1992-07-27
1994-04-19
Silbaugh, Jan H.
Metal working
Piezoelectric device making
156322, 156327, B65C 925
Patent
active
053034570
ABSTRACT:
A package for a frequency selection component includes a base, a thermoplastic die attachment, and either a soldered or low- melting-temperature glass lid attachment. These techniques can be employed in either a leadless chip carrier or a single layer ceramic base configuration. A package for a surface acoustic wave device in accordance with one embodiment of the invention is suitable for enclosing the device in a hermetically sealed environment such that the resulting structure takes up a minimum volume of space. The package facilitates automated circuit assembly techniques, allowing compact, low cost products to incorporate frequency selection components when these are made in accordance with the present invention.
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A. Shores, "Thermoplastic Films for Adhesive Bonding Hybrid Microcircuit Substrates" 1989 Electronic Components Conf. Aug. 1989.
An article entitled "SBAR Filter Monolithically Integrated with HBT Amplifier" by D. Cushman et al., presented at the 1990 IEEE Ultrasonics Symposium, Honolulu, HI, Dec. 1990.
An article entitled "Volatile Species from Conductive Die Attach Adhesives" by R. C. Benson et al., presented at the Proceedings IEEE Electrical Components Conference, IEEE Catalogue No. 89CH2775-5, Mar. 1, 1989, pp. 301-308.
An article entitled "Thermoplastic Films for Adhesive Bonding Hybrid Microcircuit Substrates", by A. Andrew Shores, 1989 Electronic Components Conference, Aug. 1989.
An article entitled "Hybrid Die-Attach Move With the Forces" by Ronald Pound, Electronic Packaging & Production, Feb. 1989.
Falkner, Jr. Robert F.
Fiorenzo Russell T.
Bogacz Frank J.
Fiorilla Christopher A.
Fliegel Frederick M.
Motorola Inc.
Silbaugh Jan H.
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