Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-01-18
2011-01-18
Garber, Charles D (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S034000, C438S069000, C438S099000, C438S780000, C257SE21007, C257SE21273, C257SE21499
Reexamination Certificate
active
07871835
ABSTRACT:
Disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bond monomer, and 0.1 to 70 parts by weight of a bulky monomer. The copolymer has transparency greater than 90%, thermal resistance greater than 130° C., and moisture absorption less than 0.5 wt %, such that the copolymer may be applied as packaging material for a light emitting device.
REFERENCES:
patent: 4931379 (1990-06-01), Brunsvold et al.
patent: 7629272 (2009-12-01), Waldfried et al.
patent: 2006/0024967 (2006-02-01), De Rege Thesauro et al.
patent: 2009/0005513 (2009-01-01), Liao et al.
Chang Feng-Chih
Chuang Ya-Lan
Kao Hsin-Ching
Lin Chih-Hsiang
Tsai Pei-Jung
Ahmadi Mohsen
Garber Charles D
Industrial Technology Research Institute
Lowe Hauptman & Ham & Berner, LLP
Topco Technologies Corp.
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