Method for packaging electronic parts and adhesive for use in sa

Details Method for packaging electronic parts and adhesive for use in sa Method for packaging electronic parts and adhesive for use in sa

1990-07-26

1992-08-11

McCamish, Marion E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

522103, 522 40, C08F 246

Patent

active

051379368

ABSTRACT:
An adhesive composition comprising 10 to 60 parts by weight per 100 parts of the total weight of components (1) to (4) of a monofunctional (meth)acrylic monomer, 0.01 to 10 parts by weight per 100 parts of the total weight of components (1) to (4) of a compound having at least two (meth)acryloyl groups in a molecule, 30 to 80 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a heat resistant epoxy resin, 0.1 to 20 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of an imidazole compound, 0.001 to 10 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a photopolymerization initiator, and 0.01 to 20 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a thixotropic agent, with which an electronic part can be effectively packaged to a printed board.

REFERENCES:
patent: 4425209 (1984-01-01), Saeki et al.
patent: 4880486 (1989-11-01), Maeda

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