Method for packaging electronic device

Details Method for packaging electronic device Method for packaging electronic device

1997-01-14

1998-07-14

Ortiz, Angela Y.

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

Flash or sprue removal type

26427215, 26427217, 264276, B29C 3342, B29C 3344, B29C 4502

Patent

active

057799580

ABSTRACT:
An electronic device packaging apparatus using molding techniques is provided. This packaging apparatus includes an upper die, a lower die, and a resin injection mechanism. The lower die is designed to mate with the upper die, and includes a cavity block which has an upper block surface and a lower block surface. The upper block surface has formed therein a mold cavity for packaging an electronic device placed between the upper and lower dies with a resin material. The lower block surface has formed therein a groove communicating with the mold cavity. The resin injection mechanism is operable to inject a melted resin material into the mold cavity of the cavity block through the groove formed in the lower block surface of the cavity block.

REFERENCES:
patent: 4188708 (1980-02-01), Frederiksen
patent: 4822550 (1989-04-01), Komathu
patent: 4861251 (1989-08-01), Moitzger
patent: 4927580 (1990-05-01), Nasu et al.
patent: 4954308 (1990-09-01), Yabe et al.
patent: 5108955 (1992-04-01), Ishida et al.
patent: 5578261 (1996-11-01), Manzione et al.

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