Method for packaging an integrated circuit using a reconstructed

Details Method for packaging an integrated circuit using a reconstructed Method for packaging an integrated circuit using a reconstructed

1993-02-01

1994-06-07

Kunemund, Robert

Fishing, trapping, and vermin destroying

437211, 437214, 437219, 437974, 437923, H01L 2148, H01L 2152, H01L 2156, H01L 2158

Patent

active

053189264

ABSTRACT:
A method of re-configuring any pre-fabricated plastic package (with or without a silicon chip and wires inside) so that an integrated circuit chip can be installed and interconnected for normal use. A pre-molded plastic package is abraded over (or molded to expose) the die attach pad and the wire bond pads. Advantageously, the encapsulating material is removed without damaging the plating material on the lead frame. A new chip is then mounted onto the chip mounting pad and new wire bonds are connected between the new chip and the lead frame. Encapsulating material, such as epoxy, is then placed over the chip and wire bonds and cured.

REFERENCES:
patent: 5138430 (1992-08-01), Gow, 3rd et al.
patent: 5149662 (1992-09-01), Eichelberger

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