Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-04-05
2005-04-05
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S825000, C029S833000, C029S840000, C438S123000, C438S124000
Reexamination Certificate
active
06874227
ABSTRACT:
A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate; mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween; pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer; testing the image sensor to determine whether the image sensor is passed or failed; and post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer.
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Chuang Jason
Hsin Chung Hsien
Tu Hsiu-Wen
You Irving
Arbes Carl J.
Kingpak Technology Inc.
Pro-Techtor Inter-national Services
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