Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1995-11-15
2000-05-30
Monin, Jr., Donald L.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438106, 438108, 257668, 257686, 257724, 257777, H01L 2324
Patent
active
060690259
ABSTRACT:
Semiconductor packaged and methods for packaging semiconductor devices are provided. A method in accordance with the invention may include the steps of: attaching solder bumps on bonding pads of a wafer; cutting the wafer into individual chips, and attaching the chips to an interface board; coupling the interface board with a lead frame; and wire-bonding the bump pads of the interface board and the inner leads of the lead frame, and carrying out a molding process. The semiconductor package may include an interface board having an interface board substrate, a plurality of interface board bump pads, wires for connecting the interface board bump pads on upper and lower faces of the substrate, and wire bonding pads electrically connected to the interface board bump pads; an upper chip and a lower chip attached on the upper and lower portions of the interface board, and electrically connected through the solder bumps to the bonding pads of the chip; inner leads and outer leads connected through wires to the wire bonding pads of the interface board; and a molding compound.
REFERENCES:
patent: 3663184 (1972-05-01), Wood et al.
patent: 4862322 (1989-08-01), Bickford et al.
patent: 4933219 (1990-06-01), Sakumoto et al.
patent: 5302854 (1994-04-01), Nishiguchi et al.
patent: 5331235 (1994-07-01), Chun
patent: 5346118 (1994-09-01), Degani et al.
patent: 5407864 (1995-04-01), Kim
patent: 5429992 (1995-07-01), Abbott et al.
patent: 5438224 (1995-08-01), Papageorge et al.
patent: 5471369 (1995-11-01), Honda et al.
patent: 5491612 (1996-02-01), Nicewarner, Jr.
patent: 5527740 (1996-06-01), Golwalkar et al.
patent: 5530292 (1996-06-01), Waki et al.
patent: 5567654 (1996-10-01), Beilstein, Jr. et al.
patent: 5570274 (1996-10-01), Saito et al.
patent: 5627405 (1997-05-01), Chillara
patent: 5719436 (1998-02-01), Kuhn
patent: 5796164 (1998-08-01), McGraw et al.
Dietrich Michael
LG Semicon Co. Ltd.
Monin, Jr. Donald L.
LandOfFree
Method for packaging a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for packaging a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for packaging a semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1909448