Method for packaging a multi-chip module of a semiconductor...

Details Method for packaging a multi-chip module of a semiconductor... Method for packaging a multi-chip module of a semiconductor...

2006-10-10

2006-10-10

Luu, Chuong Anh (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S109000, C438S110000, C438S614000, C438S666000

Reexamination Certificate

active

07118938

ABSTRACT:
A method for packaging a multi-chip module includes the steps of: connecting connection terminals of a tape of an anisotropic conductive adhesive film, on which a circuit is patterned to bond pads of the chip by applying an adhesive on the tape, applying an adhesive on an upper surface of the chip, folding the tape and attaching the folded tape to the upper surface of the chip and forming a plurality of ball terminals on a lower surface of the tape, the ball terminals being electrically connected to the connection terminals of the tape. An individual chip scale package may be manufactured by repeating the above steps.

REFERENCES:
patent: 5492235 (1996-02-01), Crafts et al.
patent: 6300679 (2001-10-01), Mukerji et al.
patent: 6737300 (2004-05-01), Ding et al.
patent: 2002/0164838 (2002-11-01), Moon et al.

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