Method for optimized dematching layer assembly in an...

Metal working – Piezoelectric device making

Reexamination Certificate

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C029S594000, C029S593000, C310S311000, C310S31300R, C310S334000, C324S727000

Reexamination Certificate

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07621028

ABSTRACT:
A method for manufacturing an acoustical stack for use within an ultrasound transducer comprises using a user defined center operating frequency of an ultrasound transducer that is at least about 2.9 MHz. A piezoelectric material and a dematching material are joined with an assembly material to form an acoustical connection therebetween. The piezoelectric material has a first acoustical impedance and *at least one of* an associated piezoelectric rugosity (Ra) and piezoelectric waviness (Wa). The dematching material has a second acoustical impedance that is different than the first acoustical impedance and at least one of an associated dematching Ra and dematching Wa. The piezoelectric and dematching materials have an impedance ratio of at least 2. The assembly material has a thickness that is based on the center operating frequency and at least one of the piezoelectric Ra, piezoelectric Wa, dematching Ra and dematching Wa.

REFERENCES:
patent: 4296349 (1981-10-01), Nakanishi et al.
patent: 4915115 (1990-04-01), Sasaki et al.
patent: 5267221 (1993-11-01), Miller et al.
patent: 6308389 (2001-10-01), Tezuka
patent: 6467138 (2002-10-01), Aime
patent: 6475151 (2002-11-01), Koger et al.
patent: 6514618 (2003-02-01), McKeighten
patent: 6551248 (2003-04-01), Miller
patent: 6685647 (2004-02-01), Savord et al.
patent: 6936008 (2005-08-01), Tarakci et al.
patent: 58006462 (1983-01-01), None
Goldberg et al, “Modeling of Piezoelectric Multilayer Ceramics Using Finite Element Analysis”, IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 44, No. 6, Nov. 1997, pp. 1204-1214.
Ehrard K. Sittig, Effects of Bonding and Electrode Layers on the Transmission Parameters of Piezoelectric Transducers Used in Ultrasonic Digital Delay Lines, IEEE Transactions on Sonics and Ultrasonics, vol. SU-16, No. 1, Jan. 1969.

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