Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2005-01-27
2008-12-02
Chowdhury, Tarifur (Department: 2886)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
Reexamination Certificate
active
07460219
ABSTRACT:
The invention concerns a method for inspecting the surface of a wafer, having at least a first and a second incident illumination device in order to emit respectively a first and a second incident illuminating light beam and to illuminate a region on the surface, and having at least one image sensing device in order to sense an image of the illuminated region, the first incident illumination device and the at least one image sensing device being arranged so that images of the illuminated region can be sensed in a bright-field configuration, and the second incident illumination device and the at least one image sensing device being arranged so that images of the illuminated region can be sensed in a dark-field configuration. A control device for controlling the first and the second incident illumination device and the at least one image sensing device is furthermore provided. The images in the bright-field configuration and the images in the dark-field configuration are acquired with a time offset from one another or with a separation from one another by color.
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Backhauss Henning
Jung Paul-Gottfried
Kreh Albert
Chowdhury Tarifur
Houston Eliseeva LLP
Pajoohi Tara S
Vistec Semiconductor Systems GmbH
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