Method for operating chemical mechanical polishing...

Details Method for operating chemical mechanical polishing... Method for operating chemical mechanical polishing...

2005-02-08

2005-02-08

Everhart, Caridad (Department: 2825)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S690000, C438S691000, C438S959000, C451S035000, C451S036000

Reexamination Certificate

active

06852633

ABSTRACT:
A method for processing integrated circuit devices including a water recycling process. The method includes operating a chemical mechanical planarization process, which includes a discharge for process water. The process water is used to process one or more semiconductor wafers. The method also selectively discharges process water from the discharge. A step of transferring the process water from the chemical mechanical planarization process to a facility process is included. The method then uses the discharged water in the facility process.

REFERENCES:
patent: 6309279 (2001-10-01), Bowman et al.
patent: 6506306 (2003-01-01), Hammer et al.
patent: 20040108277 (2004-06-01), Krulik

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