Method for off-orientation point rotation sawing of crystalline

Details Method for off-orientation point rotation sawing of crystalline Method for off-orientation point rotation sawing of crystalline

1979-01-15

1980-10-21

Combs, Ervin M.

Metal working

Method of mechanical manufacture

Utilizing transitory attached element or associated separate...

295272, 269 7, 29583, 29424, B23P 1700, H01L 766, B25B 100

Patent

active

042285780

ABSTRACT:
A method is provided for point rotation sawing of crystalline rod material at off-orientation angles wherein the crystalline rod is encapsulated in a molding media forming a cylindrical geometric encapsulation containing the rod with its crystallographic axis at an angle to the cylindrical axis of encapsulation, the angle coinciding with the off-orientation requirement. The encapsulation cylinder is rotated about its axis and contacted by sawing means at one or more points tangent to the cylinder surface and perpendicular to the cylinder's axis of rotation resulting in the sawing of a thin wafer from a cylinder which is inclusive of an off-orientation crystalline material wafer. Inside and outside diameter saws having sidewall lapping coatings provide an off-orientation point sawing method with simultaneous sawing and lapping of the resulting thin wafers as the point contact diameter becomes smaller; however, the off-orientation point sawing method utilizing the rotating cylinder is adaptable to a variety of sawing means.

REFERENCES:
patent: 2430969 (1947-11-01), Young
patent: 4110885 (1978-09-01), Fisher
patent: 4174561 (1979-11-01), House et al.
Cutting a Monocrystalline Semiconductor, Fischer et al., "IBM Technical Disclosure Bulletin", vol. 10, No. 2, Jul. 1967.

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