Method for obtaining metallurgical stability in integrated circu

Details Method for obtaining metallurgical stability in integrated circu Method for obtaining metallurgical stability in integrated circu

1994-05-06

1995-10-03

Chaudhuri, Clik

Fishing, trapping, and vermin destroying

437200, 437201, 257737, 257766, 257780, 228 45, 228904, H01L 2144

Patent

active

054551951

ABSTRACT:
A method for electrically connecting integrated circuit copper-gold ball bond that connect a bond wire (18) with a bond pad (14) forms a palladium layer (16) in the electrical connection between the bond wire (18) and the bond pad (14). The connection avoids excessive stresses that arise from intermetallic formations between the bond wire (18) and the bond pad (14).

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