Method for obtaining electrical interconnect using a solderable

Details Method for obtaining electrical interconnect using a solderable Method for obtaining electrical interconnect using a solderable

1988-02-25

1989-11-21

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

29843, 439876, H01R 909

Patent

active

048819069

ABSTRACT:
A method for providing an electrical connection (via) between the top and bottom of a printed circuit board (PCB) is presented. An eyelet extends through a hole in the PCB. The top of the PCB has a first conductive layer. Around the hole the first conductive layer is shaped such that a conductive pad is isolated from the rest of the first conductive layer, except that spokes of the first conductive layer extend from the conductive pad to the rest of the first conductive layer. The eyelet is crimped such that crimped fingers or tabs of the eyelet cause the eyelet to be mechanically retained in the hole. The tabs are curved so that the tabs do not lie flat upon the conductive pad. The bottom of the PCB is then wave soldered so that a base of the eyelet is electrically coupled to a conductive layer on the bottom of the PCB and the tabs are electrically coupled to the conductive pad.

REFERENCES:
patent: 2756485 (1956-07-01), Abramson et al.
patent: 3061911 (1962-11-01), Baker
patent: 3103547 (1963-09-01), Ansley
patent: 3601750 (1971-08-01), Mancini
patent: 3621116 (1971-11-01), Adams
patent: 3825999 (1974-07-01), Rubey
patent: 4181385 (1980-01-01), De Santis et al.
patent: 4413309 (1983-11-01), Takahashi et al.
IBM Bulletin, Stricker et al., vol. 6, No. 3, p. 15, 8-1963.

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