Method for obtaining adhesion of multilayer thin films

Details Method for obtaining adhesion of multilayer thin films Method for obtaining adhesion of multilayer thin films

1975-06-27

1976-10-19

Mack, John H.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

C23C 1500

Patent

active

039869440

ABSTRACT:
A method for obtaining adhesion of multilayer thin films through the use of a conventional sputtering system. The adhesion between the multilayer thin films is obtained by forming a graded interface between a deposit material and a substrate using an adhesion layer material. The graded interface is formed by sputtering a uniform layer of the adhesion layer material on the surface of the deposit material. The deposit material is coated on a sputtering cathode. The subsequent sputtering from this cathode results in the graded interface between the deposit material and substrate due to the radially non-uniform rate of removal of the adhesion layer material and deposit material from the cathode's surface.

REFERENCES:
patent: 3278407 (1966-10-01), Kay
patent: 3515663 (1970-06-01), Bodway
patent: 3607697 (1971-09-01), Shirn et al.
patent: 3616401 (1971-10-01), Cunningham et al.
patent: 3616406 (1971-10-01), Turner
patent: 3717563 (1973-02-01), Revitz et al.
patent: 3729406 (1973-04-01), Osborne et al.
patent: 3809635 (1974-05-01), Gillot et al.
patent: 3835007 (1974-09-01), Ferat et al.
E. L. Hollar et al "Composite Film Metallizing For Ceramics, J. Electrochem. Soc., vol. 117, pp. 1461-1462, Nov. 1970.

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