Method for non-destructive removal of cured epoxy from wafer...

Details Method for non-destructive removal of cured epoxy from wafer... Method for non-destructive removal of cured epoxy from wafer...

2007-02-06

2007-02-06

Vinh, Lan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

C438S750000, C134S001100

Reexamination Certificate

active

10989753

ABSTRACT:
Disclosed is a method for non-destructive removal of cured epoxy from a wafer backside. A wafer back-coated with epoxy is soaked in an acetone bath for a period of time, allowing degradation of the epoxy coating adhesion strength. The epoxy coating is then peeled or scraped away, leaving the wafer backside ready for a rework or for a reapplication of a new epoxy coating.

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