Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-04-05
2011-04-05
Nguyen, Khiem D (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S455000, C257S778000, C257SE21503, C257SE21511
Reexamination Certificate
active
07919357
ABSTRACT:
A resin containing conductive particles and a gas bubble generating agent is supplied between a first substrate and a second substrate, and then the resin is heated to generate gas bubbles from the gas bubble generating agent contained in the resin so that the resin is self-assembled between electrodes. Then, the resin is further heated to melt the conductive particles contained in the resin, thereby forming connectors between electrodes. A partition member sealing the gap between the substrates is provided near a peripheral portion of the resin, and gas bubbles in the resin are discharged to the outside through the peripheral portion of the resin where the partition member is absent.
REFERENCES:
patent: 6881607 (2005-04-01), Farnworth
patent: 2002/0185309 (2002-12-01), Imamura et al.
patent: 2008/0284046 (2008-11-01), Karashima et al.
patent: WO 2006/103948 (2006-10-01), None
Karashima Seiji
Kitae Takashi
Nakatani Seiichi
Sawada Susumu
McDermott Will & Emery LLP
Nguyen Khiem D
Panasonic Corporation
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