Method for mounting surface mount devices to a circuit board

Details Method for mounting surface mount devices to a circuit board Method for mounting surface mount devices to a circuit board

1997-04-24

1999-03-16

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29759, 29760, 29836, 439 72, 439 73, 439331, H05K 1304, H05K 332

Patent

active

058814531

ABSTRACT:
Disclosed is method for aligning and mounting electrical components, such as packaged integrated circuits, to a printed circuit board. During an alignment phase, a sample component is attached to a stand-in circuit board at a component site. A base plate, having alignment elements, is then fitted to the board proximate the attached sample component. Next, a chuck is mounted to the sample component, and an alignment plate positioned to engage the alignment elements of the base plate, and affixed to the chuck, forming a chuck assembly that is aligned to the base plate and registered to the component site of the circuit board. During a production phase, the base plate is placed on a printed circuit board at a location substantially identical to that on the stand-in printed circuit board. A chuck assembly, configured substantially identical to that formed during the alignment phase, and carrying a component to be mounted, is attached to the base plate so that the alignment plate engages the alignment elements. The chuck, carrying the electrical component is registered to the base plate through the alignment plate to accurately locate the component leads over the circuit pads on the circuit board.

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