Method for mounting socket contacts to dual-in-line package lead

Details Method for mounting socket contacts to dual-in-line package lead Method for mounting socket contacts to dual-in-line package lead

1975-06-30

1976-10-05

Lanham, C.W.

Metal working

Method of mechanical manufacture

Electrical device making

29628, H05K 330

Patent

active

039836231

ABSTRACT:
A method for mounting socket contacts to the leads of electronic component packages having a dual-in-line configuration, and for one-step mounting of the pre-socketed packages to dual-in-line arrays of holes in a panel board. Dual-in-line packages (DIP) are fed to a processor where a plurality of socket contacts are separated into two parallel spaced rows and the leads of the DIP are inserted into the sockets. The thus pre-socketed DIP's are repackaged for further handling, to ultimately be assembled to a panel board wherein dual-in-line arrays of holes have been drilled. The ends of the socket contacts projecting from the back side of the board are normally wave soldered for permanent electrical connection, while the IC remains in position secured to the board by means of the socket contacts.

REFERENCES:
patent: 2937358 (1960-05-01), Bulger
patent: 3611562 (1971-10-01), Herb
patent: 3834015 (1974-09-01), DiRenzo

Affiliated with

Also associated with

Rating

Method for mounting socket contacts to dual-in-line package lead does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for mounting socket contacts to dual-in-line package lead, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for mounting socket contacts to dual-in-line package lead will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-647576