Method for mounting semiconductor chip on circuit board

Details Method for mounting semiconductor chip on circuit board Method for mounting semiconductor chip on circuit board

1994-02-04

1995-09-05

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437209, 437246, 257737, 257738, 257779, H01L 2144

Patent

active

054478863

ABSTRACT:
In mounting a semiconductor chip on a circuit board by a flip chip bonding method, an improved mounting method holds the circuit with a warp prevention device, on which the semiconductor chip is placed, while the circuit board is treated with heat for the reflow of the solder bumps. As a result, the circuit board is prevented from warping when heated at a temperature at which the solder bumps melt.

REFERENCES:
patent: 3798762 (1974-03-01), Harris et al.
patent: 3905038 (1975-09-01), Beyerlein
patent: 4017963 (1977-04-01), Beyerlein
patent: 4747209 (1988-03-01), Schaeffer et al.

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