Method for mounting parts on circuit boards

Details Method for mounting parts on circuit boards Method for mounting parts on circuit boards

1979-02-06

1980-06-17

Smith, John D.

Metal fusion bonding

Process

Plural diverse bonding

228179, 228180R, 427 44, 427 96, 29834, 29840, 156275, 156281, H05K 334

Patent

active

042080053

ABSTRACT:
One or more parts having terminals can be mounted on a circuit board by coating an ultraviolet-curing and thermosetting resin composition comprising an ultraviolet-curing resin, an addition polymerizable monomer, a photosensitizer and a heat polymerization initiator, on the circuit board by screen printing with a prescribed pattern, mounting the parts on the printed resin composition, curing the resin composition by simultaneous irradiation of ultraviolet light and heat rays so as to bond the parts to the circuit board, and soldering the parts onto the circuit board.

REFERENCES:
patent: 3704515 (1972-12-01), Nelson
patent: 3859722 (1975-01-01), Kinsky et al.
patent: 4064287 (1977-12-01), Lipson et al.
patent: 4074008 (1978-02-01), Green
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4141055 (1979-02-01), Berry et al.
National Technical Report, vol. 24, No. 1, pp. 120-126, 2-1978.

Affiliated with

Also associated with

Rating

Method for mounting parts on circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for mounting parts on circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for mounting parts on circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-471572