Method for mounting of semiconductor crystals

Metal working – Method of mechanical manufacture – Electrical device making

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361400, H05K 330

Patent

active

050956272

ABSTRACT:
A process is provided for the mounting of semiconductor crystals with integrated circuits or circuit elements on a base support. In the first stage of the process, the front surface of a semiconductor crystal (1) and, substantially coplanar exposed contacts (6) on this surface, are bonded over the entire surface thereof to the base support by a dielectric substance. In a second stage, the contacts are at least partially exposed by partial etching away of the crystal (1). In the last stage, conductive connections (7) to the contacts are produced by coating of an electrically conductive material onto the base support.

REFERENCES:
patent: 3379937 (1968-04-01), Shepherd
patent: 4062107 (1977-12-01), Blackman et al.
patent: 4667401 (1987-05-01), Clements et al.
patent: 4715115 (1987-12-01), King et al.

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