Method for mounting lead terminals to circuit board

Details Method for mounting lead terminals to circuit board Method for mounting lead terminals to circuit board

1993-09-14

1996-03-12

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29845, 2281791, 228254, 219 8513, H01R 900

Patent

active

054975468

ABSTRACT:
Load terminals are mounted to a circuit board by providing a solder layer on each lead terminal and on each conductive inner wall surface of respective holes formed in the circuit board. The lead terminals are thrust into respective holes, and contacting portions of the solder layers are irradiated with an energy beam, to produce sufficient heat for welding in a fluxless manner each lead terminal to the inner wall surface of its respective hole.

REFERENCES:
patent: 4319121 (1982-03-01), Yoshida
patent: 4644643 (1987-02-01), Sudo
patent: 4877176 (1989-10-01), Kubis

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