Method for mounting integrated circuits on a printed circuit...

Details Method for mounting integrated circuits on a printed circuit... Method for mounting integrated circuits on a printed circuit...

2006-04-25

2006-04-25

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S829000, C029S834000, C361S704000, C361S707000, C257S718000

Reexamination Certificate

active

07032305

ABSTRACT:
A method of mounting electrical component assemblies on opposite sides of a printed circuit card including inserting a chock on a first side of the printed circuit card; inserting a standoff and placing a spring around each standoff; pressing the chock against the printed circuit card; mounting a first electrical component assembly on a second side of the printed circuit card; placing a package tool having a plurality of springs on a horizontal support so that when the first mounted electrical component assembly is placed inside the package tool the springs of the package tool come into contact with the first electrical component assembly; removing the chock from the printed circuit card such that the springs of the package tool compensate for the weight of the first electrical component assembly inside the package tool; and mounting a second electrical component assembly on the first side of the printed circuit card.

REFERENCES:
patent: 4159483 (1979-06-01), Bettin
patent: 4395084 (1983-07-01), Conrad
patent: 4699593 (1987-10-01), Grabbe et al.
patent: 5473510 (1995-12-01), Dozier, II
patent: 5730210 (1998-03-01), Kou
patent: 6154365 (2000-11-01), Chia-Pin et al.
patent: 6490161 (2002-12-01), Johnson
patent: 6545879 (2003-04-01), Goodwin
patent: 6680848 (2004-01-01), Petit et al.
patent: 6746261 (2004-06-01), Petit et al.
patent: 0 706 313 (1996-04-01), None

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