Metal fusion bonding – Process – Plural diverse bonding
Patent
1991-07-12
1992-04-07
Seidel, Richard K.
Metal fusion bonding
Process
Plural diverse bonding
2281802, 156299, B23K 3102, H05K 300
Patent
active
051020300
ABSTRACT:
A method for mounting electronic parts on a printed circuit board by applying an adhesive to a printed board at predetermined positions is provided. A droplet of an acryl-modified resin emulsion adhesive in a predetermined volume is ejected from a nozzle to said board at each of said positions, the adhesive is dried to remove water therefrom to ensure mounting of said parts on said binder and a solder is applied to said adhesive areas. The advantage is that an exact amount of adhesive for retaining each part on the board is obtained by each single droplet and in addition the nozzle is non-contactive to the board.
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patent: 5037700 (1991-08-01), Davis
"Use of Adhesives with Chemical Activators . . . " Research Disclosure #28814 Apr. 1988, Kenneth Mason Publications Ltd., England.
Ide Masatoshi
Tamashima Jun
Elpel Jeanne M.
Seidel Richard K.
TDK Corporation
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