Method for mounting electronic parts on a printed circuit board

Details Method for mounting electronic parts on a printed circuit board Method for mounting electronic parts on a printed circuit board

1991-10-08

1995-06-27

Barry, Chester T.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562739, 1562755, 1562757, 156295, 156299, 1563311, 1563318, B32B 3100

Patent

active

054276420

ABSTRACT:
An adhesive composition for use in the mounting of electronic parts on a printed circuit board is disclosed. The composition comprises a photosetting and thermosetting resin ingredient and a long-chain saturated fatty acid amide. Also disclosed is a method for mounting electronic parts on a printed circuit board by the use of such an adhesive composition.

REFERENCES:
patent: 3746682 (1973-07-01), Watts
patent: 3928270 (1975-12-01), South
patent: 4135033 (1979-01-01), Lawton
patent: 4208005 (1980-06-01), Nate et al.
patent: 4370404 (1983-01-01), Tachikawa
patent: 4382108 (1983-05-01), Carroll et al.
patent: 4444932 (1984-04-01), Francis
patent: 4849048 (1989-07-01), Inagaki et al.
patent: 4857111 (1989-08-01), Haubennestel

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